+ PRODUCT INTRODUCTION +

产品介绍

当前位置:首页 > 产品介绍 > 可弯折铝基板

可弯折铝基板

Product introduction- Aluminum substrate
可弯折铝基板

产品介绍 - 可弯折铝基板

Product introduction- Aluminum substrate
可弯折铝基板是一种具有良好散热功能的金属基覆铜板,铝板厚度 0.1-0.2mm。优良的导热性能保证了LED产品的快速散热。该系列产品广泛应用于LED灯具的制作。

Aluminum substrate is a kind of metal clad copper plate with good heat dissipation function. The thickness of aluminum plate is 0.1-0.2mm. The excellent thermal conductivity ensures the rapid cooling of LED products. This series of products are widely used in the manufacture of LED lamps.

·产品结构及系列  Product Structure and Series



产品结构 Product structure

产品系列 Product serides


铜箔 Copper Foil
环氧树脂 Adhesive
Pi膜 PI Film
环氧树脂 Adhesive
铝箔 Al board



铝基厚度0.1-02mm

Aluminum thickness 0.1-0.2mm



 

·产品规格 Product Specifications

Item(项目)

Test method(测试方法)

Specification(规格)

Width(幅宽)

Specification

250±1mm

Polyimide   thickness(PI厚度)

Specification

12.5um、25um

Adhesive   thickness(胶层厚度)

Specification

20±3um

Aluminum thickness(铝箔厚度)

Specification

100-200um

Copper   thickness(铜箔厚度)

Specification

35um

Shelf life(保质期)

25±10℃,65±20﹪RH

12months

 

   

·产品性能 Product Properties

Item(项目)

Test method(测试方法)

Specification(规格)

Peel   strength(剥离强度)

As   Received

(直接测试)

IPC   TM650 2.4.9

≧1.5kgf/cm

After    MEK/10min      

  (丁酮浸泡10分钟测试)

≧1.5kgf/cm

Solder   Float Resistance(耐焊性)

(after   165℃±5℃ 1hr)                    (165℃±5℃烘烤1小时后)

IPC   TM650 2.4.13

288℃ 10sec

Dimensional stability(尺寸稳定性)

IPC TM650 2.2.4

TD≦±0.2%

MD≦±0.2%

Chemical   resistance(耐化学品性)

MEK   5min(丁酮浸泡5分钟测试)

IPC   TM650 2.3.2

No   evident of defects

Hcl   5% 5min (5%盐酸溶液浸泡5分钟测试)

NaOH   5% 5min (5%氢氧化钠溶液浸泡5分钟测试)

Surface   Resistivity(Ω)(表面电阻率)

IPC   TM650 2.5.17

≧1.0*1013Ω

Volume   Resistivity(Ω.cm)                   (体积电阻率)

IPC   TM650 2.5.17

≧1.0*1015Ω.cm

Insulation   Resistance(Ω)

(感应电阻率)

IPC   TM650 2.6.3.2

≧1.0*1011Ω







·产品应用  Product Application

该系列产品广泛应用于LED灯具的制作。

This series of products are widely used in the manufacture of LED lamps.